Pick and place machines are one thing, but plugging in tiny connectors, screws that need a little wiggle to go in the hole, things like that are a different story.
Probably also a factor is that you would be spinning up a whole production line and automation systems for phones that will only be in production for 12 to 18 months, after which you’d have to adapt or redo everything for the new model.
Weird. Not like pcb fabs haven’t been doing that for ages. And not necessarily the solder flood type chip mounts either.
Pick and place machines are one thing, but plugging in tiny connectors, screws that need a little wiggle to go in the hole, things like that are a different story.
Probably also a factor is that you would be spinning up a whole production line and automation systems for phones that will only be in production for 12 to 18 months, after which you’d have to adapt or redo everything for the new model.